Paste 2009Proceedings of the Twelfth International Seminar on Paste and Thickened Tailings |
For the third time since 2002 and 2005, the International Seminar on Paste and Thickened Tailings returned to Chile, which provides the growing interest for this emerging technology. Some large applications in the Chilean copper industry are now in development. This publication contains the proceedings of the Twelfth International Seminar on Paste and Thickened Tailings held on 21-24 April 2009 in Vina del Mar, Chile. It comprises a total of 40 technical papers and two keynote addresses written by authors from nine countries. |
Editors: Richard Jewell, Andy Fourie, Sergio Barrera and Jacques WiertzSponsors |